ULTRABRITE 707

Mirror-bright, highly levelled acid copper plating process with exceptional brightness, throwing power and high LCD coverage

ULTRABRITE 707 is an advanced bright acid copper plating system engineered to produce mirror-bright, highly levelled copper deposits within a very short plating time. The system provides excellent bright deposits on properly treated plastics and metals, and can be used as an undercoat for non-specified nickel plating operations, thereby helping to save nickel. It offers exceptional levelling over a wide current density range, excellent brightness and throwing power, and high LCD coverage, ensuring brilliant deposits even in recessed areas. The process is temperature tolerant up to 45°C, free of harmful by-products, simple to maintain and economical to run. The system comprises ULTRABRITE 707A (brightener/leveller responsible for levelling and brightness, especially LCD brightness at higher temperatures), ULTRABRITE 707B (base brightener and grain refiner across the entire current density range, which also prevents gas pore formation), ULTRABRITE 707M (make-up additive responsible for excellent throwing power and grain refinement, replenished mainly to compensate drag-out) and ULTRABRITE 761 W (wetting agent added over-the-side to minimize pitting and pore formation). The bath operates at 20–40°C with cathode current densities of 1.0–6.0 A/dm², using phosphorized copper anodes (0.03–0.06% P) with continuous filtration, and is easily controlled through routine analysis and Hull Cell studies.